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Flat ribbon conductor is made original wire rolled with precision into the shape of Nano Ribbon
Wire.
It is used FFC(flexible flat cable) for electronic parts, car and medical instrumentsl, solar module.
Features: Surface of the product is not discolored and it have optimum levels of
size, tensile strength, elongation.
Spec:Thickness:
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Features
- Common cathode type surge protection diode
- P/N Diode
- Electrodes : Top side : Anode (Al or Au)
Back side :Cathode (Au)
Chip size Includes scribe lane. The chip size is about (0.38±0.015 x 0.31±0.015) mm2 after
dicing.
Wafer thickness : 100 µm ± 10 µm
Chip size : 0.40 mm x 0.33mm
Top metal : Al
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This semiconductor deodorizer, which was developed to innovatively control high-concentration combined bad smells coming from food, sewage sludge, digesters and composting facilities, continuously decomposes matters with bad smells using low amounts of energy with innovative technologies by achieving oxidative decomposition through the use of
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On the water tight aluminum compressing conductor, a cross-linked polyethylene is insulated and divided into a low pressure distribution line skinned with PVC and an overhead line requiring a large seal load.
Structure
Conductor: round aluminum compressed and stranded cable (grade 2) for electricity
Water tight: water tight tape
Insulator:
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Air Heater
Super Air Heater, Heating of door trim of cars. thermal setting (welding), Automatic soldering by
heating of wire conductor, heating of cosmetics.
Super Air Heater is required for each type of industrial process. Rapid heating is enabled with the
minimum size for spot heating (partial heating) by using the compressor air. This
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Cure Oven is an equipment for drying semi-conductor equipment with precise temperature control. This is a secondhandproduct in good condition.
Features :1. Product’s condition is good.
2. Low-priced product since it is an urgent sale.
3. Direct product inspection available upon
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Features
- Common cathode type surge protection diode
- P/N Diode
- Electrodes : Top side : Cathode (Al)
Back side : Anode (Au)
Application Circuits
Wafer thickness : 100 µm ± 10 µm
Chip size : (0.17±0.02)2 mm2
Top metal : Al or Au
Back metal : Au
Bonding PAD : 0.14 mm x 0.14
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Features
- Transient protection for data lines to
IEC 61000-4-2 level4(ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 level4(EFT) 40A (tp = 5/50 ns)
IEC 61000-4-5 (Lightning) 8A(tp = 8/20 µs)
- Protects one I/O or power line
- Low junction capacitance 30 pF
- Low clamping voltage
- Low leakage current
- Ultra small package
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Introduction
MS-100
Carbon CLEANER
? Features
• It is able to completely dissolve metal rust, carbon deposits, and oxidized deposits without damaging the coated layer and the metal surface, at room temperature
• It safely removes the rust compared to existing non-organic acid
(hydrochloric acid, nitric acid, sulfuric acid)
• It
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Features
- Common cathode type surge protection diode
- P/N Diode
- Electrodes : Top side : Anode (Al or Au)
Back side :Cathode (Au)
Chip size Includes scribe lane. The chip size is about (0.38±0.015 x 0.31±0.015) mm2 after
dicing.
Wafer thickness : 100 µm ± 10 µm
Chip size : 0.40 mm x 0.33mm
Top metal : Al
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Introduction
Rust Cleaner Seaclean zf Series
? Outline
Seclean® ZF-C (coating type) and Seclean® ZF-D (precipitation type) are special cleansers that remove rust or scales formed on welded joints.
In addition, they are able to rapidly and effectively remove various pollutants (oil, dust) in a room- temperature environment without
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This semiconductor deodorizer, which was developed to innovatively control high-concentration combined bad smells coming from food, sewage sludge, digesters and composting facilities, continuously decomposes matters with bad smells using low amounts of energy with innovative technologies by achieving oxidative decomposition through the use of
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Introduction
DAC–107Dz
High functional aluminum enchant
DAC–107Dz is a surface processing agent that removes oil and the oxidized layer of the aluminum surface at once to provide an even shine.
? Features
• It is able to improve the manufacturing rate by reducing the time needed for manufacturing process
• By minimizing
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Features
- Common cathode type surge protection diode
- P/N Diode
- Electrodes : Top side : Cathode (Al)
Back side : Anode (Au)
Application Circuits
Wafer thickness : 100 µm ± 10 µm
Chip size : (0.17±0.02)2 mm2
Top metal : Al or Au
Back metal : Au
Bonding PAD : 0.14 mm x 0.14
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Introduction
High Performanced Gas Mixers for welding, semiconductor, food packing machine
Our Technology
Based on well-established technology, our volumetric mixers are reliable and built to offer a long-life service. This cost effective series is ideal for harsh environments and difficult to handle and corrosive fluids.
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Features
- Transient protection for data lines to
IEC 61000-4-2 level4(ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 level4(EFT) 40A (tp = 5/50 ns)
IEC 61000-4-5 (Lightning) 8A(tp = 8/20 µs)
- Protects one I/O or power line
- Low junction capacitance 30 pF
- Low clamping voltage
- Low leakage current
- Ultra small package
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[ Product Description ]
Closed Loop Control
High Speed & high accuracy
Fast response PM BLDC Linear Servo Motor
[ Product Features
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BOC
BOC (Board on Chip) : BOC is the structure that connects bonding pad on substrate to the bonding
pad of chip with memory chip bonding side to the laminated substrate by using wire-bonding
in the central slot.
It has characterstics to have the bonding and solder side of the substrate in one plane and It
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[Product Description]
-Solder Ball
Solder balls are commonly used in area array package such as BGA, CSP & Flip-Chip, which forms electrical & mechanical solder joint between Pacakge Substrate & Main PCB and more recently micro bumps for inter connection instead of Au or Cu wiring. Duksan Hi-Metal is one of world