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Hard materials coating(eg. CrN, TiN, TiAlN)
Anti-corrosive coating(eg. ZrN)
Special Features
Vacuum arc system for mass production(base pressure: 1 X 10-6 Torr).
Pumping system equiped with mechanical booster and oil diffusion pumps.
Automatically or manually controlled in substrate revolution and rotation.
Batch type of substrate
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2011/10/31
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KSN
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Sputter,Sputtering,Vacuum Evaporator,Vacuum Coating System,Used Sputter,Used Sputtering,Used Vacuum Evaporator,Used Vacuum Coating System
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2318000 - 0100
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AMS-0401D
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1
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USA
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CLIO
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Diaphragm Metalligations
Special Features
Roll to Roll System for mass production.
PC control based on PLC.
Metal deposition on flexible film
Flexible film thickness: 2um
Speedy deposition and throughput
Loading capacity : 5km per day
Average throughput 1,800km per year
Specifications
Dimension : 2,714L x 3,393H x 2,008W
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Multi-functional cluster system combined with PECVD, sputter and E-beam evaporation for high quality graphene synthesis.
Special Features
Multi-functional cluster system combined with PECVD, sputter and E-beam evaporation for high quality graphene synthesis.
Maximum substrate heater temperature: 1,000°C for PECVD, 800°C for Sputter and
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Touch Screen Panel manufacturing
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[Product Description]:
Sputtering System
Used for thin-film transister patterning process for LCD panel and thin-film solar cell production by coating oxide or metallic materials on large size
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Sputtering technology is a metalizing process whereby a "target" metal is literally atomically bombarded with positive ions, breaking down the target, which is negatively charged, atom by atom. PET film is unwound and passed over target materials. "Excited" atoms are then collected and evenly deposited onto ultra-clear optical grade polyester